The global Die Attach Solder Pastes market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The USA market for Global Die Attach Solder Pastes market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
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The China market for Global Die Attach Solder Pastes market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The Europe market for Global Die Attach Solder Pastes market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint. Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content.
This report aims to provide a comprehensive presentation of the global market for Die Attach Solder Pastes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Die Attach Solder Pastes. This report contains market size and forecasts of Die Attach Solder Pastes in global, including the following market information:
Global Die Attach Solder Pastes Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Die Attach Solder Pastes Market Sales, 2018-2023, 2024-2030, (Tons)
Global top five Die Attach Solder Pastes companies in 2022 (%)
No-Clean Solder Pastes Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Die Attach Solder Pastes include SMIC, Alpha Assembly Solutions, Indium Corporation, Heraeu, Shenmao Technology, Henkel, Shenzhen Weite New Material, TONGFANG TECH and Sumitomo Bakelite, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Die Attach Solder Pastes manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks. Total Market by Segment:
Global Die Attach Solder Pastes Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (Tons)
Global Die Attach Solder Pastes Market Segment Percentages, by Type, 2022 (%)
No-Clean Solder Pastes
Rosin Based Solder Pastes
Water Soluble Solder Pastes
Others
Global Die Attach Solder Pastes Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (Tons)
Global Die Attach Solder Pastes Market Segment Percentages, by Application, 2022 (%)
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others
Global Die Attach Solder Pastes Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (Tons)
Global Die Attach Solder Pastes Market Segment Percentages, By Region and Country, 2022 (%)
North America (United States, Canada, Mexico)
Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
The Middle East and Africa (Middle East, Africa)
South and Central America (Brazil, Argentina, Rest of SCA)
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Die Attach Solder Pastes revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Die Attach Solder Pastes revenues share in global market, 2022 (%)
Key companies Die Attach Solder Pastes sales in global market, 2018-2023 (Estimated), (Tons)
Key companies Die Attach Solder Pastes sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
SMIC
Alpha Assembly Solutions
Indium Corporation
Heraeu
Shenmao Technology
Henkel
Shenzhen Weite New Material
TONGFANG TECH
Sumitomo Bakelite
AIM
Tamura
Asahi Solder
Kyocera
Shanghai Jinji
NAMICS
Hitachi Chemical
Nordson EFD
Dow
Inkron
Palomar Technologies
Chapter 1: Introduces the definition of Die Attach Solder Pastes, market overview.
Chapter 2: Global Die Attach Solder Pastes market size in revenue and volume.
Chapter 3: Detailed analysis of Die Attach Solder Pastes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Die Attach Solder Pastes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Die Attach Solder Pastes capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
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