The global Semiconductor Back Grinding Tapes market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The USA market for Global Semiconductor Back Grinding Tapes market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
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The China market for Global Semiconductor Back Grinding Tapes market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The Europe market for Global Semiconductor Back Grinding Tapes market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Back Grinding Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Back Grinding Tapes. This report contains market size and forecasts of Semiconductor Back Grinding Tapes in global, including the following market information:
Global Semiconductor Back Grinding Tapes Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Semiconductor Back Grinding Tapes Market Sales, 2018-2023, 2024-2030, (K Sqm)
Global top five Semiconductor Back Grinding Tapes companies in 2022 (%)
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
UV Curable Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Back Grinding Tapes include Mitsui Chemicals Tohcello, Lintec, Denka, Nitto, Furukawa Electric, D&X, AI Technology, Taicang Zhanxin and Plusco Tech, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Semiconductor Back Grinding Tapes manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Back Grinding Tapes Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Sqm)
Global Semiconductor Back Grinding Tapes Market Segment Percentages, by Type, 2022 (%)
UV Curable
Non-UV Curable
Global Semiconductor Back Grinding Tapes Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Sqm)
Global Semiconductor Back Grinding Tapes Market Segment Percentages, by Application, 2022 (%)
6 Inch
8 Inch
12 Inch
Others
Global Semiconductor Back Grinding Tapes Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Sqm)
Global Semiconductor Back Grinding Tapes Market Segment Percentages, By Region and Country, 2022 (%)
North America (United States, Canada, Mexico)
Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
The Middle East and Africa (Middle East, Africa)
South and Central America (Brazil, Argentina, Rest of SCA)
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Back Grinding Tapes revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Back Grinding Tapes revenues share in global market, 2022 (%)
Key companies Semiconductor Back Grinding Tapes sales in global market, 2018-2023 (Estimated), (K Sqm)
Key companies Semiconductor Back Grinding Tapes sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsui Chemicals Tohcello
Lintec
Denka
Nitto
Furukawa Electric
D&X
AI Technology
Taicang Zhanxin
Plusco Tech
Shanghai Guku
Boyan
BYE
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Back Grinding Tapes, market overview.
Chapter 2: Global Semiconductor Back Grinding Tapes market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Back Grinding Tapes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Back Grinding Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Back Grinding Tapes capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
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